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Solutions in Soldering Technology

Thermal Gap-fillers

These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly. High Thermal Conductivity can be achieved with a non-silicone utilising metal oxide (ceramic) powders.

Silicone Gap Filler - GF300 / GF400

Silicone Gap Filler - GF300 / GF400

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Thermal Gap Pad - GP300 / GP500

Thermal Gap Pad - GP300 / GP500

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Thermally Conductive Oxime RTV - TCOR

Thermally Conductive Oxime RTV - TCOR

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Non-Silicone Heat Transfer Compound PLUS Xtra - HTCPX

Non-Silicone Heat Transfer Compound PLUS Xtra - HTCPX

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Thermally Conductive Ethoxy RTV - TCER

Thermally Conductive Ethoxy RTV - TCER

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